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What is the reason why the nickel layer of the plating board is peeled?

- May 29, 2018 -

It is recommended to move in several steps: 1. Check whether the warehouse is humid; 2. Do CASS 48 hours, water resistance and moisture resistance test, plating thickness test, and verify that your plating process is in accordance with preliminary analysis. The wet environment makes the three-layer protective nickel layer Corrosion, copper layer exposed, surface rust. The specific situation depends on the test results. The scale on the copper-nickel surface can only be removed by chemical heat treatment. Hydrogen protection can only reduce surface oxide scale and cannot be eradicated. Now the use of sand removal of phosphorus or abrasive belt grinding, nickel generally does not rust, if the general rust of sandpaper is not acceptable, heat treatment will rust it? In that case, it is not impossible to handle very thin foils. For example, a foil with a thickness of 0.006 mm, the scale on the copper-nickel surface can only be removed by chemical heat treatment, and the hydrogen protection can only restore the surface oxide scale and cannot be eradicated. Strictly speaking, it is not to throw gold but to throw nickel that is plated for the second time. You think that the gold layer has nickel on the surface of the PCB. So you say gold is thrown away. In fact, the gold that is thrown off is attached to the second layer of nickel. .

What is the reason why the nickel layer of the plating board is peeled?.jpg

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