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What is the difference between high acid and low copper and high copper and low acid in electroplating copper

- May 26, 2018 -

High acid and low copper, sulfuric acid 180g/L~220g/L, copper sulfate 50~80g/L; The advantage is that the dispersibility (TP) is strong enough and the thickness uniformity is good; the disadvantage is poor leveling and weak gloss. Hair's test 2A, the right high zone over 1 ~ 2cm easily scorched. But the ability to take a strong position, generally applied to the through-hole plate plating. Dk is generally controlled at 2~4 ASD without problems. 2, high copper and low acid, copper sulfate 180g/L~220g/L, sulfuric acid 50~80g/L; Advantages are micro leveling ability, strong gloss; thickness uniformity is slightly worse; Hastelloy test 2A, whole piece Mirror light

What is the difference between high acid and low copper and high copper and low acid in electroplating copper.jpg

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