1, the mold problem
The molds used in stamping processing are generally specialized. Sometimes a complex part requires several sets of molds to be formed, and the mold manufacturing has high precision and high technical requirements, and is a technology-intensive product. Therefore, only in the case of large batch production of stamping parts, the advantages of stamping processing can be fully reflected, thus obtaining better economic benefits.
2, security issues
There are also some problems and shortcomings in stamping. Mainly manifested in the noise and vibration generated during stamping processing, and the operator's safety accidents occur. However, these problems are not entirely due to the stamping process and the mold itself, but mainly due to the traditional stamping equipment and backward manual operations. With the advancement of science and technology, especially the development of computer technology, with the advancement of mechatronics technology, these problems will be solved as soon as possible and perfect.
3. High-strength steel stamping
Today's high-strength steel and ultra-high-strength steel achieve the light weight of the vehicle and improve the collision strength and safety performance of the vehicle, thus becoming an important development direction of the steel for the vehicle. However, with the improvement of the strength of the sheet, the conventional cold stamping process is prone to cracking during the forming process, and cannot meet the processing requirements of the high-strength steel sheet. In the case where the molding conditions cannot be satisfied, the hot stamping forming technology of ultra high-strength steel sheets has been gradually studied internationally. This technology is a new process that combines forming, heat transfer and tissue phase transformation. It mainly uses the high-temperature austenite state, the plasticity of the sheet increases, and the yield strength is reduced. However, thermoforming requires in-depth study of process conditions, metal phase transitions, and CAE analysis techniques. Currently, this technology is monopolized by foreign manufacturers, and domestic development is slow.